Appeal No. 2001-1776
Application No. 08/881,948
Fujitsu (Brief, page 7). Appellants also argue that they cannot
see any reason that these devices would be combined (Brief, page
8).
These arguments are not persuasive. Fujitsu and Zejda are
both directed to coating devices with the same problem and
solution therefore. Fujitsu is directed to a sputtering device
for forming a thin film on a substrate (page 1). Fujitsu teaches
that the prior art adhesively bonds the target to the backing
plate with its attendant problems (pages 2-3). Fujitsu solves
this problem by presenting a sputtering device that has a target
screwing mechanism without using a bonding agent (paragraph
bridging pages 3-4). Fujitsu discloses that replacing the target
after use is not easy, leading to a time-consuming task of
releasing the bonding and re-bonding the target, but the
“screwing mechanism of the present invention is easy and can be
efficiently maintained.” Page 5, ll. 11-14.
Zejda discloses that in a coating apparatus it is necessary
to replace the targets, which replacement is complicated, time
consuming and expensive (col. 1, ll. 39-44). To solve this
problem, Zejda provides a quick disconnect coupling for securing
targets to enable simple and fast mounting/dismounting of targets
(col. 1, ll. 50-54). As part of this rapid replacement, Zejda
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