Ex Parte JIANG et al - Page 1



          The opinion in support of the decision being entered today was                
          not written for publication and is not binding precedent of the               
          Board.                                                                        
                                                              Paper No. 20              
                      UNITED STATES PATENT AND TRADEMARK OFFICE                         
                                      __________                                        
                          BEFORE THE BOARD OF PATENT APPEALS                            
                                   AND INTERFERENCES                                    
                                      __________                                        
                        Ex parte TONGBI JIANG and ZHIPING YIN                           
                                      __________                                        
                                 Appeal No. 2001-2315                                   
                                Application 09/145,106                                  
                                      ___________                                       
                               HEARD: September 7, 2002                                 
                                      ___________                                       
          Before HAIRSTON, FLEMING, and GROSS, Administrative Patent                    
          Judges.                                                                       
          FLEMING, Administrative Patent Judge.                                         
                                  DECISION ON APPEAL                                    
               This is a decision on appeal from the final rejection of                 
          claims 27 through 40.  Claims 1 through 26 have been canceled.                
               The invention relates to providing a passivation layer                   
          comprising plasma polymerized methylsiloxane extending over                   
          portions of the die and the die carrier of a packaged integrated              
          circuit device.                                                               

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