Appeal No. 2001-2315
Application 09/145,106
silicon as passivation and protective coatings in semiconductor
devices, but Biederman does not disclose or suggest the use of
passivation coatings on both a die and a die carrier. Appellants
further argue on pages 3 and 4 of the supplemental brief that
Verzaro does not teach or suggest the use of passivation coatings
on both a die and a die carrier but instead teaches the use of
plasma polymerization in forming a protective layer on the
surface of a plastic substrate. In the reply brief, Appellants
further argue that the prior art of record contains no motivation
or suggestion to modify the Yew reference to use plasma
polymerized methylsiloxane for a passivation layer extending over
the portion of the die and the die carrier.
On page 4 of the Examiner’s answer, the Examiner argues that
one of ordinary skill in the art would modify the Yew reference
using the Biederman and Verzaro teachings to provide stability at
elevated temperatures.
As pointed out by our reviewing court, we must first
determine the scope of the claim. “[T]he name of the game is the
claim.” In re Hiniker Co., 150 F.3d 1362, 1369, 47 USPQ2d
4
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