Appeal No. 2001-2315
Application 09/145,106
Independent claim 27 is reproduced as follows:
27. A packaged integrated circuit device, comprising:
a die carrier;
an integrated circuit die mounted onto a surface of the die
carrier; and
a passivation layer comprising plasma polymerized
methylsiloxane extending over portions of the die and the die
carrier.
REFERENCES
The references relied on by the Examiner are as follow1:
Verzaro et al. (Verzaro) 5,569,497 Oct. 29, 1996
Yew et al. (Yew) 5,956,233 Sep. 21, 1999
(filed Dec. 19, 1997)
Biederman et al., “Plasma Polymerization Processes: Plasma
Technology, volume 3, 1992, pages 183-203.
REJECTION AT ISSUE
Claims 27 through 40 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Yew in view of Biederman and Verzaro.
1 We note that the Examiner has cited additional references
in the Examiner’s answer on pages 3 and 4. However, these
additional references have not been applied in the 35 U.S.C.
§ 103 rejection. Therefore these references are not properly
before us for our consideration for the rejection of the claims
under 35 U.S.C. § 103.
2
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007