Appeal No. 2002-1182
Application 09/233,385
packaging” (specification, page 1).1 Representative claims 50
and 51 read as follows:
50. A flip chip electronic module comprising
a semiconductor chip;
a substrate for mounting said chip; and
a dielectric interposer disposed between said chip and
substrate having a plurality of apertures, said apertures
traversing a thickness of said interposer, and solder elements
deposited within said apertures, said solder elements being cone
shaped prior to thermal reflow,
wherein said module is thermally reflowed such that said
chip and said substrate are electrically and mechanically
interconnected by said solder elements and said solder elements
are not in contact with an adjacent solder element.
51. The module of claim 50 wherein said solder elements are
coated with tin.
THE PRIOR ART
The references relied on by the examiner to support the
final rejection are:
Pasch et al. (Pasch) 5,111,279 May 5, 1992
Rostoker et al. (Rostoker) 5,569,963 Oct. 29, 1996
Dalal et al. (Dalal) 5,729,896 Mar. 24, 1998
1 Flip chip packaging involves technology wherein “[b]roadly
stated, one or more integrated circuit chips are mounted above a
single or multi-layer ceramic substrate and pads on the chip are
electrically and mechanically connected to corresponding pads on
the substrate by a plurality of electrical connections such as
solder bumps” (specification, page 1).
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007