Appeal No. 2002-1182
Application 09/233,385
generally cylindrical ‘mold’ of predetermined dimension wherein
the solder joints are formed” (column 5, lines 54 through 57).
Determining that Pasch does not respond to the limitations
in claim 50 requiring the solder elements deposited within the
apertures to be “cone shaped prior to thermal reflow,” the
examiner turns to Rostoker.
Rostoker also pertains to flip chip technology and
encompasses the disclosure of Pasch.3 Rostoker additionally
teaches a flip chip embodiment 1100a (see Figure 11b) comprising
a silicon die or chip 1110, a dielectric interposer 1120 having
through holes 1150a and 1150b, a substrate 1130 and reflowed
solder bump contacts 1142a and 1142b in the through holes
electrically and mechanically connecting the die and substrate.
Rostoker’s description of this embodiment indicates that the
reflowed solder bump contacts were formed from aligned solder
ball contacts initially located on the die and substrate and
positioned to extend into the interposer through holes prior to
reflow.
3 According to the Rostoker patent (see column 1, lines 6
through 18; and column 8, line 12 et seq.), the Pasch patent is
one of its parents.
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