Appeal No. 2002-1182
Application 09/233,385
§ 1.192(c)(8). In other words, claims 53 through 61 stand or
fall with claim 50, and claim 52 stands or falls with claim 51.
II. The merits
Pasch, the examiner’s primary reference, discloses a flip
chip structure which is described in terms of its method of
assembly as follows:
FIG. 3 illustrates the present, inventive
technique of assembling flip-chips 30. . . . [T]he
flip-chip assembly 30 includes one or more silicon
chips 32 (two of such chips are illustrated) ultimately
mounted in face-to-face relationship to a larger
silicon chip or substrate 14 in the following manner.
Solder balls 36 are formed on the face 32A of the chip
32, and solder balls 38 are formed on the face 34A of
the substrate 34 in corresponding positions. . . .
Prior to soldering the chips 32 to the substrate
34, a preformed planar [dielectric] structure 40 . . .
of similar planar dimension as the chip 32, is
interposed between the chips 32 and the substrate 34.
The planar structure 40 is provided with though holes
42 in positions corresponding to the positions of the
solder balls 26 [sic, 36] and 38, respectively.
Inasmuch as the solder balls 36 are typically located
just within the perimeter of the chips 32, the through
holes 42 would be located just within the perimeter of
the planar structure 40 [column 3, line 51, through
column 4, line 7].
Pasch adds that “the holes 42 in the planar structure 40
assist in maintaining registration of the solder balls 36 and
corresponding solder balls 38, respectively, and hence alignment
of the chips 32 with respect to the substrate 34” (column 4,
lines 38 through 42), and that “the through holes 42 form a
4
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