The opinion in support of the decision being entered today was not written
for publication and is not binding precedent of the Board.
Paper No. 34
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte SYUN-MING JANG
and CHEN-HUA YU
____________
Appeal No. 2001-0430
Application No. 08/697,699
____________
ON BRIEF
____________
Before HAIRSTON, DIXON, and BLANKENSHIP, Administrative Patent Judges.
HAIRSTON, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1, 2, 4 through 6, 8 through 10 and 24.
The disclosed invention relates to a method of forming a gap filling sandwich composite
dielectric layer construction for use within an integrated circuit. A gap filling dielectric layer is
sandwiched between a first and a second conformal dielectric layer. The first conformal dielectric
layer is formed through a first plasma enhanced chemical vapor deposition (PECVD) of a first
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