Appeal No. 2001-1550
Application 09/105,830
Meikle teaches a barrier material for use in preventing
interdiffusion of silicon and aluminum at the silicon/aluminum
interfaces. See Meikle’s abstract as well as column 2, lines 58
through 61. Summerfelt teaches an adhesion layer 26 in order to
create an in situ dielectric layer on which the inner electrode
may adhere. See column 4, lines 19 through 44. Similarly
Kashihara teaches an adhesion layer 353 to provide adhesion as
well as to provide a barrier to prevent a silicification
reaction. See column 9, lines 53 through 65, and column 15,
lines 22 through 54.
We fail to find though that Summerfelt or Kashihara is
concerned with the same problem of Meikle which is to provide a
barrier material for use in preventing interdiffusion of
silicon/aluminum at the silicon/alumininum interfaces.
Therefore, we fail to find that one of ordinary skill in the art
would look to Meikle to substitute the materials used in Meikle
for the materials used in Summerfelt or Kashihara for the
adhesion layers. Therefore, we fail to find that the Examiner
has provided any evidence as to reasons why one of ordinary skill
in the art would make the modification as proposed. Therefore,
we will not sustain the Examiner’s rejection under 35 U.S.C.
§ 103.
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