Appeal No. 2001-1633
Application 09/092,543
Representative claims 13 and 24 are reproduced as follows:
13. A method for applying a fluid to a silicon wafer surface
comprising:
rotating a receiving surface about an axis;
flowing a fluid onto said receiving surface proximate said
axis;
projecting an energy stream against an observation location
on said receiving surface;
monitoring said observation location to gather information
about said receiving surface; and
altering the flow of said fluid to said receiving surface in
view of said information.
24. A method for applying a fluid to a silicon wafer surface
comprising:
rotating a receiving surface about an axis;
dispensing a fluid from a first nozzle adjacent said axis
onto said receiving surface;
monitoring the outward flow of said fluid along said
receiving surface; and
dispensing said fluid from a second nozzle onto said
receiving surface when said fluid flows outwardly to a radius
from said axis, said second nozzle being remote from said first
nozzle.
The examiner relies on the following references:
Ushijima 5,393,624 Feb. 28, 1995
Lin et al. (Lin) 5,646,071 July 08, 1997
Claims 13-16 stand rejected under 35 U.S.C. § 102(e) as
being anticipated by the disclosure of Ushijima. Claims 1-5, 24-
26 and 30-32 stand rejected under 35 U.S.C. § 103. As evidence
of obviousness the examiner offers Lin in view of Ushijima.
Rather than repeat the arguments of appellants or the
examiner, we make reference to the briefs and the answer for the
respective details thereof.
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