Appeal No. 2002-0544 Page 2
Application No. 09/095,157
BACKGROUND
Appellants’ invention is directed to a ceramic joint
structure for an electrostatic chuck used in semiconductor wafer
processing. The ceramic joint structure reduces corrosion of a
metal member which is joined to a ceramic member even if the
structure is exposed to air at a high temperature during wafer
processing (specification, page 3). The embedded member includes
at least molybdenum whereas the joint layer is made of more than
50% by weight of one or more metals from the group consisting of
gold, platinum and palladium (specification, page 7).
Representative independent claim 1 is reproduced as follows:
1. A ceramics joint structure in which a ceramics
member having an oxidation resistance property and a metal
member are joined via a joint layer, comprising a structure
such that:
(1) an embedded member made of a metal including at
least molybdenum is embedded in said ceramics member;
(2) a part of said embedded member is exposed to a
joint surface of said ceramics member to form a metal
exposing portion which is contacted with said joint layer;
(3) said ceramics member and said metal exposing
portion are joined via said joint layer to said metal member
respectively; and
(4) said joint layer comprises more than 50% by weight
with respect to all the metal in the joint layer of at least
one metal selected from the group consisting of gold and
palladium.
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