Ex Parte NAKAMURA - Page 1




               The opinion in support of the decision being entered today was not    
               written for publication and is not binding precedent of the Board.    
                                                                Paper No. 31         
                      UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                    
                          BEFORE THE BOARD OF PATENT APPEALS                         
                                  AND INTERFERENCES                                  
                                     ____________                                    
                              Ex parte KATSUMI NAKAMURA                              
                                     ____________                                    
                                Appeal No. 2002-0647                                 
                              Application No. 09/122,094                             
                                     ____________                                    
                                HEARD: March 20, 2002                                
                                     ____________                                    
          Before BARRETT, GROSS, and LEVY, Administrative Patent Judges.             
          GROSS, Administrative Patent Judge.                                        



                                  DECISION ON APPEAL                                 
               This is a decision on appeal from the examiner's final                
          rejection of claims 1 and 2.                                               
               Appellant's invention relates to a semiconductor device               
          having a trench.  Claim 1 is illustrative of the claimed                   
          invention, and it reads as follows:                                        
               1.   A semiconductor device comprising:                               
               a semiconductor substrate having main surface;                        
               a trench having an opening on said main surface and a bottom          
          portion in said semiconductor substrate respectively;                      
               an insulating film being provided on an inner wall of said            
          trench and a portion of said main surface around said opening;             
          and                                                                        








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