Appeal No. 2002-0899
Application No.09/609,652
The claimed invention relates to an integrated electronic
device having first and second electrodes formed, respectively,
on first and second substrates. An electronic connection
connecting the first and second electrodes is formed that
consists of first, second, and third solder regions arranged in
series between the electrodes. The first and second electrodes
are made of different materials that, respectively, are repellant
and adhesive to molten solder.
Claim 25 is illustrative of the invention and reads as
follows:
25. An integrated electronic device comprising:
a first substrate having a first electrode formed on a first
surface of the first substrate;
a second substrate having a second electrode formed on a
first surface of the second substrate, the second substrate
opposing to the first substrate so that the second electrode is
aligned to the first electrode; and
an electronic connection connecting the first electrode with
the second electrode, the electronic connection consisting of
first, second, and third solder regions arranged in series
between the first and second electrodes such that the first
region is electrically connected with the first electrode and the
second region while the third region is electrically connected
with the second electrode and the second region, wherein the
first and second electrodes are made of different materials from
each other.
-2–2
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