Appeal No. 2002-0934
Application No. 09/392,276
device that receives power from two power supply voltage sources. One of the
power supply voltage sources is coupled to the back side of the semiconductor die.
(Brief, p. 2). Claim 1, which is representative of the claimed invention, appears
below:
1. In a semiconductor device that receives power from a first power
supply voltage source and a second power supply voltage source
different from said first power supply voltage source, a power supply
arrangement, comprising:
a semiconductor die having a top side and an opposing back side, the
die including
a semiconductor substrate relatively heavily doped with impurities of
a first conductivity type and providing the back side of the
semiconductor die, and
a first semiconductor layer disposed over the substrate relatively more
lightly doped than said semiconductor substrate with impurities of the
first conductivity type;
said first power supply voltage conductor coupled to the back side of
the die and to said first power supply voltage source for utilization
within said die.
Since we reverse the Examiner’s rejection, we need to address only the
independent claims, i.e., claims 1 and 9.
The semiconductor device of claims 1 and 9 require two power supply
sources. Both the claims require a power supply source to provide voltage to the
bottom surface of the device.
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