Ex Parte Cai et al - Page 4



          Appeal No. 2002-2087                                                        
          Application No. 09/733,836                                                  

          active regions of the semiconductor device, and a trench “by                
          definition” can not be formed on the surface of the substrate               
          (Answer, page 4).  Since the examiner finds that the source and             
          drain contact structures are not formed below the substrate                 
          surface, the examiner determines that there is no support for               
          source and drain contact structures extending through the STI               
          (id.).                                                                      
               Accordingly, the examiner also finds that the claims are               
          indefinite under paragraph two of section 112 since it is “unclear          
          as to how a trench can be formed over the substrate” (Answer, page          
          4).                                                                         
               Although the examiner appears to confuse the requirements of           
          section 112 for written description, enablement, and definiteness,2         
          the initial burden of establishing unpatentability on any ground            
          rests with the examiner.  See In re Oetiker, 977 F.2d 1443, 1445,           
          24 USPQ2d 1443, 1444 (Fed. Cir. 1992).  Under the written                   
          description requirement of the first paragraph of section 112, the          
          examiner must establish that the originally filed disclosure would          
          not have reasonably conveyed to one of ordinary skill in this art           

               2See Vas-Cath Inc. v. Mahurkar, 935 F.2d 1555, 1563, 19                
          USPQ2d 1111, 1117 (Fed. Cir. 1991); and In re Angstadt, 537 F.2d            
          498, 501, 190 USPQ 214, 217 (CCPA 1976).                                    
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