Appeal No. 2003-0175
Application No. 09/769,976
a plurality of solder ball bond pads each having a gold coating;
a plurality of wire bond bond pads each having a gold coating; and
the gold coating on said solder ball bond pads being thinner than
the gold coating on said wire bond bond pads.
The references relied upon by the examiner are:
Kano 5,380,679 Jan. 10, 1995
Calviello 4,692,997 Sep. 15, 1987
Grounds of Rejection1
1. Claims 31, 32 and 36 stand rejected under 35 U.S.C. § 102(b) as anticipated
by Kano.
2. Claims 33-35 stand rejected under 35 U.S.C. § 103(a) as unpatentable over
Kano in view of Calviello.
We affirm as to both grounds of rejection.
1 The rejection of claims 31-36 under 35 U.S.C. § 112, second paragraph, has been withdrawn.
Examiner’s answer, paper no. 10, mailed June 28, 2002, page 4, paragraph (6).
2
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