Ex Parte Tandy - Page 5




              Appeal No. 2003-0175                                                                                     
              Application No. 09/769,976                                                                               


              necessarily or inherently possess the characteristics of the claimed structure.  In re                   
              Best, 562 F.2d 1252, 1255, 195 USPQ 430, 433 (CCPA 1977).  In the present case,                          
              we find that the examiner has properly shifted the burden to appellant to show that the                  
              claimed structure is different from that of Kano.                                                        
                     Appellant argues that the terms “solder ball bond pads” and “wire bond bond                       
              pads” “are terms that are used in the art to distinguish bond pads having different                      
              characteristics.  Thus, these limitations are not merely statements of intended use.”                    
              Appeal brief, page 9.  In support of his contention, appellant relies on the teaching of                 
              Trask et al., U.S. Patent No. 5,311,404 (“Trask”).  Id.                                                  
                     We have reviewed Trask and cannot agree with appellant that the disclosure                        
              supports appellant’s position that the aforementioned terms are known in the art as                      
              distinguishing bond pads having different characteristics.  In fact, appellant’s own                     
              specification appears to support the examiner’s contention that these terms merely                       
              recite an intended use for the bond pads.  See specification, page 6, lines 17-20 (“the                  
              bond pads 40 may be solder ball bond pads for coupling to solder balls (not shown).                      
              The bond pads 42 may be wire bond bond pads for coupling to bonding wires 50.")                          
              (emphasis added).  Moreover, while appellant asserts that solder ball bond pads and                      
              wire bond bond pads are known to have different characteristics, appellant fails to state                




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