Ex Parte Cha et al - Page 1




         The opinion in support of the decision being entered today was not         
         written for publication and is not binding precedent of the Board.         
                                                           Paper No. 14             

                     UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                    __________                                      
                         BEFORE THE BOARD OF PATENT APPEALS                         
                                  AND INTERFERENCES                                 
                                    __________                                      
                              Ex parte CHER LIANG CHA,                              
                                    KOK KENG ONG,                                   
                                         and                                        
                                      ALEX SEE                                      
                                    __________                                      
                                Appeal No. 2003-0230                                
                             Application No. 09/624,025                             
                                    ___________                                     
                                      ON BRIEF                                      
                                    ___________                                     

         Before KIMLIN, MOORE, and POTEATE, Administrative Patent Judges.           
         MOORE, Administrative Patent Judge.                                        
                                  DECISION ON APPEAL                                
              This is an appeal under 35 U.S.C. § 134 from the final                
         rejection of claims 1-6, 8-12, 14-18, and 20.  Claims 7, 13, and           
         19 have been canceled.  Thus, only claims 1-6, 8-12, 14-18, and 20         
         are before us on this appeal.                                              
                                 REPRESENTATIVE CLAIM                               
              Claim 1 is representative, and reads as follows:                      
              1.  A method of fabricating an integrated circuit isolation           
         region comprising:                                                         
              providing a semiconductor substrate;                                  






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