Appeal No. 2003-0524
Application No. 09/593,816
The examiner states that, as it is clear from figure 2 that the
terminals seating in the depressions of the landing pads are solder
terminals, the claimed structure would have been obvious over Saitoh
alone. (Examiner=s Answer, page 4, lines 10-12). Alternatively,
the examiner notes that AAPA teaches solder terminals in figure 1.
The examiner then alternatively concludes that it would have been
obvious to use solder terminals in Saitoh=s device to obtain good
electrical contact between the chip and the landing pad.
(Examiner=s Answer, page 4, lines 13-17).
On the other hand, the appellant urges that there is no factual
basis to support the Examiner=s determination that the landing pad
is the portion above element 1 (Appeal Brief, page 5, lines 2-4).
We agree with the appellant. The examiner=s rejection appears
to be founded on the assumption that the trapezoidally shaped
portion containing what appears to be a depression is a part of the
landing pad on the substrate. It is clear from a reading of Saitoh
that the lands (illustrated as non bonded in Figure 10) are the
lower, rectangular portion, and that the upper portion which the
examiner refers to as containing a depression is not a part of the
landing pad. Consequently, we disagree with the examiner that a
teaching of the claimed depression exists in Saitoh. We therefore
reverse this rejection.
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