Appeal No. 2003-0524
Application No. 09/593,816
The Rejection of Claims 5-8 Under 35 U.S.C. ' 103(a)
Claim 5 recites the limitation that the bonding pads comprise
eutectic solder. The examiner has found that Glenn discloses
eutectic solder bonding pads, and the appellant urges that Glenn
does not cure the argued deficiencies in the combination of AAPA and
Saitoh. We agree with the appellant. As claims 5-8 depend from
claim 1, and we have reversed that rejection for the reasons stated
above, we consequently reverse this rejection as well.
Summary of Decision
The rejection of claims 1-4 under 35 U.S.C. ' 103(a) over
Saitoh and AAPA is reversed.
The rejection of claims 5-8 under 35 U.S.C. '103(a) over Saitoh
and AAPA in view of Glenn is reversed.
REVERSED
EDWARD C. KIMLIN )
Administrative Patent Judge )
)
)
) BOARD OF PATENT
BEVERLY A. PAWLIKOWSKI )
Administrative Patent Judge ) APPEALS AND
)
) INTERFERENCES
)
JAMES T. MOORE )
Administrative Patent Judge )
JM/dpv
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