Appeal No. 2003-0672 Page 2
Application No. 09/151,886
BACKGROUND
The appellant's invention relates to a non-electrically conductive, low profile
thermal dissipator for attachment to the heat transfer surface of an electronic
component for the conductive and/or convective cooling of the component
(specification, p. 1). A copy of the claims under appeal is set forth in the appendix to
the appellant's brief.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Kurokawa 5,291,064 March 1, 1994
Kesel 5,550,326 Aug. 27, 1996
Dumoulin et al. (Dumoulin) WO 97/150782 Apr. 24, 1997
IBM Technical Disclosure Bulletin, "Aluminum Nitride Heat Sink to the Chip," TDB-ACC-
NO: NA9001182; Volume 32, Issue No. 8A, pages 182-183; January 1, 1990
(IBM TDB No. NA9001182)
Claims 1, 3 to 6, 9 to 12, 16, 18 to 21, 24 to 27, 31, 33 to 36 and 39 to 42 stand
rejected under 35 U.S.C. § 103 as being unpatentable over the combined teachings of
Kesel and IBM TDB No. NA9001182, further in view of Kurokawa and Dumoulin.
2 In determining the teachings of Dumoulin, we will rely on, as did the examiner, U.S. Patent No.
6,122,172.
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