Appeal No. 2003-0672 Page 7
Application No. 09/151,886
thickness of less than about 100 mils (2.5 mm) which extends generally coterminously
with or within the margins of the second heat transfer surface of the source.
Dumoulin discloses injection-molded substrates that carry electrical connections
and that are equipped with heat sinks. Dumoulin teaches (column 3, lines 4-14) that:
In an embodiment, it is particularly advantageous for the heat sink to be
composed of metal, or alloys including chromium, nickel or a mixture thereof
which allow good thermal conductivity with low thermal expansion at the same
time.
In an embodiment, a heat sink composed of ceramic can also
successfully be used, in this case, in an embodiment, the heat sink preferably
being composed, in particular, of aluminum oxide. Such ceramic materials also
ensure good thermal conductivity with low thermal expansion at the same time.
As shown in the drawings, the heat sink is larger than chip. Dumoulin does not teach or
suggest using a generally planar thermal dissipation member formed of a thermally
conductive, electrically-nonconductive ceramic aluminum oxide material having a
thickness of less than about 100 mils (2.5 mm) which extends generally coterminously
with or within the margins of the second heat transfer surface of the source.
While each of the features claimed by the appellant may have been known at the
time the invention was made to a person of ordinary skill in the art from the combined
teachings of the applied prior art, it is our opinion that the claimed subject matter as a
whole would not have been suggested by the applied prior art since that art does not
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