Ex Parte MORADI - Page 4



          Appeal No. 2003-1249                                                        
          Application 09/386,972                                                      

               Itoh discloses a method for cleaning, evacuating and sealing           
          a flat panel display device by 1) repeatedly, several times,                
          feeding the device with electricity to emit electrons from the              
          cathode for several minutes while evacuating the device to about            
          10-7 Torr, introducing reducing gas into the device until the               
          pressure is 10-2 to 500 Torr, holding this pressure in the device           
          for a few minutes, and evacuating the device to about 10-7 Torr,            
          2) evacuating the device for about 6 hours at about 300ºC, and              
          3) sealing an evacuation tube or sealing lid to form a high                 
          vacuum in the device (col. 6, line 64 - col. 7, line 27).                   
               Watkins discloses a method for evacuating and then sealing a           
          field emission display device (col. 1, lines 6-8).  The device is           
          evacuated by maintaining it in a chamber at a pressure which can            
          be 10-8 Torr for a sufficient time, e.g., 1-2 hours, to reach               
          equilibrium and outgas water and other contaminants through a gap           
          between the device’s peripheral seal material and back plate, and           
          is sealed by compressing and optionally heating the seal material           
          (col. 6, lines 5-31).                                                       
               The examiner argues that the reason why Konuma removes                 
          harmful gas atoms to the greatest extent feasible and limits the            
          time of operation during evacuation apparently is to protect the            
          cathode from damage by ion bombardment during sputter cleaning of           
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