Appeal No. 2003-1262
Application No. 09/620,679
BACKGROUND
Appellant’s invention is generally directed to a driver for
high speed data communication, and more specifically, to a method
for matching the output impedance of a driver to the load of the
interconnect lines. By matching the load, the voltage levels and
the impedance remain substantially constant with variations in
the manufacturing process, the voltage levels and the operating
temperature. Representative independent claim 7 is reproduced
below:
7. A method of communicating data in an integrated
circuit using internal interconnects, the method comprising:
receiving a data signal;
adjusting a first resistance coupled to a first supply
voltage, based on a manufacturing process, the first supply
voltage and a temperature;
adjusting a second resistance coupled to a second
supply voltage, based on the manufacturing process, the
first supply voltage and the temperature; and
adjusting a third resistance coupled to the second
supply voltage, based on the manufacturing process, the
first supply voltage and the temperature.
The Examiner relies on the following references in rejecting
the claims:
Knee et al. (Knee) 5,337,254 Aug. 9, 1994
Esch, Jr. (Esch) 6,118,310 Sep. 12, 2000
(filed Nov. 4, 1998)
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