Ex Parte PRALL - Page 4




          Appeal No. 2003-1556                                                        
          Application 09/288,932                                                      


          structure as claimed, however, includes a removable spacer layer            
          which is “adapted to be completely removed when isotropically               
          etched.”  Hence, the ability of the removable spacer layer to be            
          completely removed when isotropically etched is a capability                
          requirement of part of the claimed semiconductor structure.                 
               The examiner considers Kobayashi’s second insulator                    
          layer (26) to correspond to the appellant’s removable spacer                
          layer (answer, pages 3-4).  The examiner argues that one of                 
          ordinary skill in the art would have been led to replace                    
          Kobayashi’s second insulator layer with Cathey’s removable spacer           
          layer (21) (col. 4, line 63 - col. 5, line 2; col. 5, lines 9-13)           
          so that the layer could be removed without significantly etching            
          the first insulator layer (24) and enlarging the size of a buried           
          contact opening between adjacent word lines (answer, page 4).               
               Kobayashi, however, does not indicate that any of the first            
          insulator layer is removed when the desired portion of the second           
          insulator layer is etched away.  In fact, Kobayashi shows that              
          after the second insulator layer has been etched, the first                 
          insulator layer remains almost completely covered by the second             
          insulator layer (figure 2D).  Moreover, Kobayashi leaves a                  
          portion of the second insulator layer in place to surround or               
          confine the contact hole (col. 4, lines 5-14; figure 2G).  For              

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