Ex Parte CHAUG - Page 2




              Appeal No. 2002-1397                                                                                      
              Application No. 09/310,800                                                                                

                                                   BACKGROUND                                                           
                     The invention is directed to a multi-track magnetic tape head that includes “gluing                
              vias” to increase flow of the adhesive used between surfaces of bonded portions.  The                     
              “gluing vias” may be photolithographically defined and subsequently trenched to create                    
              the desired pattern.1  Representative claim 21 is reproduced below.                                       
                     21.    A multi-recording element magnetic head assembly operable for at least                      
                     one of reading from and writing to a multi-track medium moving across the head                     
                     assembly, comprising:                                                                              
                            a plurality of recording elements operable for at least one of reading from                 
                     and writing to the multi-track medium;                                                             
                            a core;                                                                                     
                            at least one gluing via located between two adjacent recording elements                     
                     of the plurality of recording elements, said at least one gluing via in contact with,              
                     and extending from, said core; and                                                                 
                            an adhesive inserted into said core and said at least one gluing via.                       
                     The examiner relies on the following reference:                                                    
              Tsutaki et al. (Tsukaki)                  5,022,140                   Jun. 11, 1991                       
                     Claims 1, 3-6, 8-10, and 19-29 stand rejected under 35 U.S.C. § 102 as being                       
              anticipated by Tsutaki.                                                                                   
                     Claims 11-14, 16-18, and 30 have been withdrawn from consideration.                                
                     Claims 2, 7, and 15 have been canceled.                                                            

                     1 We are unable to find pages 4 and 5 of the specification in the instant file wrapper.  The       
              examiner should resolve the deficiency in the file.  For our understanding of the invention, we referred to
              the portion of the specification that is present and to the disclosure of U.S. Patent 5,943,196, which is a
              parent of the instant (divisional) application.                                                           
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