Ex Parte FOGAL et al - Page 1



               The opinion in support of the decision being entered                   
               today was not written for publication in a law journal                 
               and is not binding precedent of the Board.                             
                                                               Paper No. 26           

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                       Ex parte RICH FOGAL and MICHAEL B. BALL                        
                                                                                     
                                Appeal No. 2003-2104                                  
                             Application No. 09/422,887                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     
          Before KIMLIN, TIMM and JEFFREY T. SMITH, Administrative Patent             
          Judges.                                                                     
          KIMLIN, Administrative Patent Judge.                                        

                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 7-17,             
          all the claims remaining in the present application.  Claims 7              
          and 9 are illustrative:                                                     
          7.  A method of stacking a plurality of die, comprising                     
               mounting an upper die on a lower die; and                              
               defining a minimum angular offset with said mounting,                  
                    wherein said minimum angular offset allows access to a            
                    bonding site on said lower die.                                   

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