Appeal No. 2003-2104
Application No. 09/422,887
9. A method of manufacturing a multichip module including dies,
comprising:
stacking all of said dies in a manner such that
corresponding portions of any two of said dies define
respective axes, and wherein said axes define an offset
angle;
bonding wire to said dies; and
ensuring that said step of stacking all of said dies occurs
with no intervening bonding step.
In the rejection of the appealed claims, the examiner relies
upon the following reference:
de Givry 0,489,643 June 10, 1992
(European Patent Application)
Appellants' claimed invention is directed to a method of
stacking a plurality of die of a semiconductor device. The
method entails defining a minimum angular offset for an upper die
mounted on a lower die which allows access to a bonding site on
the lower die. According to appellants, "[a] minimum angle is
especially preferable if it is desired to stack the maximum
number of dies while still ensuring clearance for the wire bonds
leading to each die" (page 2 of principal brief, first
paragraph).
Appealed claims 7-17 stand rejected under 35 U.S.C. § 102(b)
as being anticipated by de Givry.
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