Ex Parte Schroen - Page 1




          The opinion in support of the decision being entered today was              
          not written for publication and is not binding precedent of the             
          Board.                                                                      
                                                            Paper No. 26              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                     __________                                       
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                     __________                                       
                             Ex parte WALTER H. SCHROEN                               
                                     __________                                       
                                Appeal No. 2004-0700                                  
                             Application No. 09/531,671                               
                                     __________                                       
                                      ON BRIEF                                        
                                     __________                                       

          Before GARRIS, PAK, and KRATZ, Administrative Patent Judges.                
          GARRIS, Administrative Patent Judge.                                        

                                 DECISION ON APPEAL                                   
               This is a decision on an appeal from the non-final rejection           
          of claims 14-22 and 24-39 which are all of the claims remaining             
          in the application.                                                         
               The subject matter on appeal relates to a method of                    
          packaging integrated circuits comprising the steps of (1)                   
          providing a plurality of integrated circuit chips, each chip                

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