Appeal No. 2004-0700
Application No. 09/531,671
having a surface and a periphery, and a sheet of lead frames and
(ii) encapsulating the integrated circuits and at least a portion
of each lead frame, each encapsulated integrated circuit and
opposing lead frame forming a discrete integrated circuit
package. Further details of this appealed subject matter are set
forth in representative independent claim 14 which reads as
follows:
14. A method of packaging integrated circuits, comprising
the steps of:
providing a plurality of integrated circuit chips, each chip
having a surface and a periphery, and a sheet of lead frames;
disposing said sheet of lead frames opposite said plurality
of integrated circuit chips, each integrated circuit chip
disposed opposite one of said lead frames, each integrated
circuit chip including an integrated circuit therein, each lead
frame including leads, the entire lead frame and leads disposed
within said periphery of said opposing integrated circuit chip;
electrically coupling the leads of each lead frame to the
opposing integrated circuit chip; and
encapsulating the integrated circuits and at least a portion
of each lead frame, each encapsulated integrated circuit and
opposing lead frame forming a discrete integrated circuit
package.
The references set forth below are relied upon by the
examiner in the section 102 and section 103 rejections before us:
Olla et al. (Olla) 4,743,956 May 10, 1988
Sato et al. (Sato) 5,519,251 May 21, 1996
Khandros et al. (Khandros) 5,685,885 Nov. 11, 1997
(filed Oct. 7, 1994)
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007