Appeal No. 2004-1357
Application 09/587,281
THE INVENTION
The invention relates to “a method for cutting an obverse
protecting sheet that is used for a semiconductor wafer when
machining with a back grinder” (specification, page 1).
Representative claim 4 reads as follows:
4. A method for cutting a protecting sheet of a wafer
having a first face and a second face, wherein the first face has
a level part, wherein a chamfered inclined surface is provided at
a periphery of the wafer, and wherein the first face is
substantially covered by the protecting sheet, the protective
sheet extending over the chamfered inclined surface and the
second face is to be subjected to backgrinding, comprising the
step of:
cutting protecting sheet so that a diameter of the
protecting sheet is at least equal to a diameter of the level
part of the first face and smaller than an outer diameter of the
wafer, and removing the protecting sheet from at least part of
the chamfered including surface;
wherein the step of cutting further comprising the step of:
arranging a cutting tool at an inclined angle relative to the
first face while cutting so that a cut face of the protecting
sheet and the level surface of the first surface form an obtuse
angle; and wherein the inclined angle of the cutting tool is
adjusted according to a form of the chamfered part of the wafer
and a finishing thickness of the wafer.
2
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