Appeal No. 2004-1357
Application 09/587,281
protecting tape when cut covers the level surface and extends
over a small portion of the chamfered peripheral edge. Also of
interest is Nishida’s discussion of breakage suffered by wafers
ground by the conventional method versus those ground by
Nishida’s inventive method:
[0032] In the cases where the rear surface grinding of
wafers with an original thickness of 630 :m was
performed so that the thickness after the rear surface
grinding was 400 :m, the number of wafers with
breakings is shown below. . . .
[0033] In the case where the rear surface grinding was
performed according to the conventional method, the number
of wafers with breakings with a size of 300 :m or more was
one, the number of wafers with breakings with a size of 100
:m to 300 :m was four, and the number of wafers with
breakings with a size of 100 :m or less was 125.
[0034] In the case where wafers of the same number were
ground according to the present embodiment, the number
of wafers with breakings with a size of 100 :m or less
was 89 and there were no wafers with breakings with a
size of 100 :m or more [translation, page 7].
Anticipation is established only when a single prior art
reference discloses, expressly or under principles of inherency,
each and every element of a claimed invention. RCA Corp. v.
Applied Digital Data Sys., Inc., 730 F.2d 1440, 1444, 221 USPQ
385, 388 (Fed. Cir. 1984). It is not necessary that the
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