The opinion in support of the decision being entered today was not written for publication and is not binding precedent of the Board. UNITED STATES PATENT AND TRADEMARK OFFICE _______________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES _______________ Ex parte SATOSHI NAKAMURA ______________ Appeal No. 2004-1412 Application 09/818,686 _______________ ON BRIEF _______________ Before KIMLIN, WARREN and OWENS, Administrative Patent Judges. WARREN, Administrative Patent Judge. Decision on Appeal This is an appeal under 35 U.S.C. § 134 from the decision of the examiner finally rejecting claims 1, 6, 7, 10 through 13 and 15 through 22. Claim 1 is illustrative of the claims on appeal: 1. A printed wiring board with an electronic component mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting heat internally generated, comprising: a first heat radiating pattern for conducting heat which is formed on a front surface of said electronic component, and connected to said heat radiating plate of the electronic component by soldering; a second heat radiating pattern for conducting heat which is formed on a rear surface of said circuit board at a position being opposed to said electronic component, and heat radiating means mounted on said second heat radiation pattern by soldering at a position being opposed to the electronic component, wherein - 1 -Page: 1 2 3 4 5 6 7 8 9 10 11 NextLast modified: November 3, 2007