Ex Parte Nakamura - Page 6


               Appeal No. 2004-1412                                                                                                   
               Application 09/818,686                                                                                                 

               of the plate and the first heat radiating pattern on the opposed side of the circuit board.  The                       
               transitional term “comprising” opens the appealed claims to encompass printed wiring boards                            
               that have structure, such as additional heat radiating structure, in addition to that recited.  See,                   
               e.g., Vehicular Technologies Corp. v. Titan Wheel Int’l Inc., 212 F.3d 1377, 1383, 54 USPQ2d                           
               1841, 1845 (Fed. Cir. 2000)In re Baxter, 656 F.2d 679, 686-87, 210 USPQ 795, 802-03 (CCPA                              
               1981) (“As long as one of the monomers in the reaction is propylene, any other monomer may be                          
               present, because the term ‘comprises’ permits the inclusion of other steps, elements, or                               
               materials.”).                                                                                                          
                       We find that one of ordinary skill in this art would have found in the disclosure of                           
               Christopher at col. 4, lines 22-38, and Christopher FIG. 2, that the thermally conductive path                         
               includes, in order, an unnumbered heat-radiating plate under each of the heat-generating                               
               components 119 and 225;  respective first heat radiating pattern solder layers 203 and 227;                            
               respective metalized vias 205 and 229;  and the respective second heat radiating pattern solder                        
               layers 203 and 227, to reach the heat radiating means having respective surfaces 113'' and 223                         
               mounted on respective second heat radiating pattern solder layers 203 and 227, as shown by                             
               Christopher FIG. 2 (cols. 3-4).                                                                                        
                       We agree with the examiner that the printed wiring board shown in Christopher FIG. 2                           
               differs from the claimed printed wiring board encompassed by the appealed claims in that the                           
               second heat radiating pattern layers 121 and 121' do not have a larger area than the first heat                        
               radiating pattern layers 203 and 227 (answer, page 3; see also brief, page 7).  We also agree with                     
               appellant that “as shown in Fig. 2 of [Christopher], a heat radiating plate (not numbered) of                          
               [Christopher] is mounted under the electronic components 119 and 225 and has an area smaller                           
               than those of radiating patterns 203, 227, 121 and 121'” (reply brief, page 3).                                        
                       However, we find in these respects that there are no dimensions disclosed by Christopher                       
               for the heat radiating plate, or for the first and second heat radiating pattern layers.  We determine                 
               that, prima facie, one of ordinary skill in this art armed with the common knowledge that the area                     
               of a metal layer is a result effective variable with respect to heat radiation, as seen, for example,                  
               from the disclosure in Christopher with respect to metal plate 278 (col. 4, lines 61-64), would                        
               have found in the absence of a disclosure of dimensions for the elements of the thermally                              


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