Ex Parte Nakamura - Page 9


               Appeal No. 2004-1412                                                                                                   
               Application 09/818,686                                                                                                 

               that thermally conductive metal used to plate surfaces can include “copper, but may be any other                       
               thermally conductive” material (col. 2, line 66, to col. 3, line 4).  Miyagi discloses that suitable                   
               plating materials include copper and nickel (e.g., col. 5, lines 45-47).  Christopher further teaches                  
               that solder forms heat radiating patterns and thus is thermally conductive (e.g., col. 4), and we                      
               take notice that it is well known that tin is a component of solder generally.                                         
                       Accordingly, prima facie, one of ordinary skill in this art routinely following the                            
               combined teachings of Christopher and Miyagi would have reasonably arrived at printed wiring                           
               boards that have a plated layer as a heat radiating element of the thermally conductive path which                     
               contains nickel or tin as required by appealed claims 16 through 18 without recourse to                                
               appellant’s specification.  See Dow Chem., supra; Keller, supra.                                                       
                       In view of the prima facie case of obviousness under § 103 established over the combined                       
               teachings of Christopher and Miyagi, the burden of going forward has shifted to appellant to                           
               submit argument and/or evidence in rebuttal.  See generally, In re Piasecki, 745 F.2d 1468, 1472,                      
               223 USPQ 785, 788 (Fed. Cir. 1984).                                                                                    
                       We have considered appellant’s arguments in the brief and reply brief with respect to                          
               whether they pertain to the new ground of rejection of all of the appealed claims which we explain                     
               above.  We acknowledged above the difference that appellant identified between the claimed                             
               invention encompassed by the appealed claims and the disclosure of Christopher in addition to the                      
               difference identified by the examiner.  However, appellant has not otherwise addressed the issues                      
               that we raise above with respect to the combined teachings of Christopher and Miyagi.                                  
                       Accordingly, the burden of going forward with respect to this ground of rejection remains                      
               with appellant.  See Piasecki, supra.                                                                                  
                       This decision contains a new ground of rejection pursuant to 37 CFR § 1.196(b)(2003).                          
               37 CFR § 1.196(b) provides that, “A new ground of rejection shall not be considered final for                          
               purposes of judicial review.”                                                                                          
                       37 CFR § 1.196(b) also provides that the appellant, WITHIN TWO MONTHS FROM THE                                 
               DATE OF THE DECISION, must exercise one of the following two options with respect to the                               
               new ground of rejection to avoid termination of proceedings (§ 1.197(c)) as to the rejected                            
               claims:                                                                                                                


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