Ex Parte Kimura et al - Page 2




          Appeal No. 2004-1436                                                        
          Application No. 09/583,865                                                  


               re-baking said semiconductor substrate;                                
               exposing said overlying layer material and resist to light             
          beams to form a resist pattern;                                             
               post-baking said semiconductor substrate;                              
               developing said resist using a predetermined developing                
          solution; and                                                               
               removing said overlying layer material together with said              
          developing solution.                                                        
               9.  An article comprising an overlying layer material                  
          covering a resist layer, the overlying layer comprising a water-            
          soluble acid substances and a water-soluble photo base generator.           
               The examiner relies upon the following references as                   
          evidence of obviousness:                                                    
          Watanabe et al. (Watanabe)        5,529,888         Jun. 25, 1996           
          Winkle                            5,650,261         Jul. 22, 1997           
          Kazumasa et al. (JP '630)         JP 06-118630      Apr. 28, 1994           
          (Japanese patent)                                                           
               Appellants' claimed invention is directed to incorporating a           
          water-soluble photo base generator into an overlying layer which            
          covers a pattern-forming resist layer.  It is conventional in the           
          art to use a cover film comprising an acidic component which                
          deactivates basic components of the air that negatively impact              
          the acid forming agent of the resist.  According to appellants,             
          however, the conventional approach results in the undesirable               
          diffusion of acid into the underlying resist layer.  Appellants'            


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