Appeal No. 2004-2040
Application No. 09/772,985
details of this appealed subject matter are recited in
representative claim 27, the only independent claim on appeal,
reproduced below:
27. A method of producing an electronic device,
comprising the steps of:
providing a flexible board having a first surface
and an opposite second surface with connection lands
provided on the first surface;
mounting at least two chips on the first surface
of the flexible board and at least two chips on the
second surface of the flexible board;
dispensing an adhesive made of an insulating
material on one of the at least two chips mounted on
the first surface of the flexible board to cover the
one chip;
folding the flexible board into a first sidewise
U-shaped configuration so that the one chip covered by
the adhesive faces the other chip mounted on the first
surface of the flexible board with the flexible board
being sufficiently folded and an amount of the
dispensed adhesive covering the one chip mounted on
the first surface of the flexible board being
sufficient so that the other chip mounted on the first
surface of the flexible board is immersed in the
adhesive resulting in completely covering both chips
mounted on the first surface of the flexible board
with the dispensed adhesive contacting facially-
opposing first surface mounting areas of the first
surface of the flexible board surrounding the
respective chips mounted on the first surface of the
flexible board;
dispensing the adhesive one [sic] of the at least
two chips mounted on the second surface of the
flexible board to cover the one chip;
folding the flexible board into a second sidewise
U-shaped configuration to form a S-shaped flexible
board so that the one chip mounted on the second
surface of the flexible board and covered by the
adhesive faces the other chip mounted on the second
surface of the flexible board with the flexible board
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