Appeal No. 2004-2040
Application No. 09/772,985
surface of the flexible board surrounding the
respective chips mounted on the second surface of the
flexible board...[Emphasis added.]
Thus, for each of the recited first and second surfaces of the
flexible board, a specified adhesive dispensing step is followed
by a specified folding step.
According to the examiner (answer at 3-4), one skilled in
the art would have “[d]ispensed an adhesive made of an
insulating material to cover the chips in an encapsulating
arrangement” and “[f]olded the flexible board in first and
second U shaped configurations to form a S shaped board so that
the one chip covered by the adhesive faces the other chip
mounted on the second surface of the flexible board...” To
support this contention, the examiner relies on the disclosures
in Paurus at: column 3, lines 35-37; column 4, lines 24-28 and
39; column 5, lines 28-31; and column 6, lines 28-31. (Answer
at 4.)
We cannot agree with the examiner’s analysis. The relied
upon portions of Paurus do not describe the dispensing of an
adhesive followed by the folding of the flexible board for each
of the first and second surfaces of the flexible board, as
required by appealed claim 27. Instead, Paurus teaches
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