Appeal No. 2004-2040
Application No. 09/772,985
As method steps, appealed claim 27 recites in part:
dispensing an adhesive made of an insulating
material on one of the at least two chips mounted on
the first surface of the flexible board to cover the
one chip;
folding the flexible board into a first sidewise
U-shaped configuration so that the one chip covered by
the adhesive faces the other chip mounted on the first
surface of the flexible board with the flexible board
being sufficiently folded and an amount of the
dispensed adhesive covering the one chip mounted on
the first surface of the flexible board being
sufficient so that the other chip mounted on the first
surface of the flexible board is immersed in the
adhesive resulting in completely covering both chips
mounted on the first surface of the flexible board
with the dispensed adhesive contacting facially-
opposing first surface mounting areas of the first
surface of the flexible board surrounding the
respective chips mounted on the first surface of the
flexible board...[Emphasis added.]
The appealed claim further recites:
dispensing the adhesive one [sic] of the at least
two chips mounted on the second surface of the
flexible board to cover the one chip;
folding the flexible board into a second sidewise
U-shaped configuration to form a S-shaped flexible
board so that the one chip mounted on the second
surface of the flexible board and covered by the
adhesive faces the other chip mounted on the second
surface of the flexible board with the flexible board
being sufficiently folded and an amount of the
dispensed adhesive covering the one chip mounted on
the second surface of the flexible board being
sufficient so that the other chip mounted on the
second surface of the flexible board is immersed in
the adhesive resulting in completely covering both
chips mounted on the second surface of the flexible
board with the dispensed adhesive contacting facially-
opposing second surface mounting areas of the second
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