Appeal No. 2004-2226
Application NO. 10/066,421
Tacitly granting the request, the examiner entered an answer
(mailed June 8, 2004), noted a reply brief (filed July 27, 2004)
submitted by the appellants and forwarded the application to this
Board for review of the new rejections of claims 1, 2 and 4
through 21, all of the claims currently pending in the
application.
THE INVENTION
The invention relates to “the fabrication and packaging of
semiconductor devices, specifically a method and system of
bonding wires from a semiconductor die to a lead using interposer
pads” (specification, page 1). Representative claim 1 reads as
follows:
1. A method and system of wire bonding a semiconductor die
to a lead, comprising steps of:
attaching a first end of a first bonding wire to a
semiconductor die with a ball bond;
attaching a second end of the first bonding wire to an
interposer pad with a stitch bond;
attaching a first end of a second bonding wire to the
interposer pad with a ball bond; and
attaching the second end of the second bonding wire to the
lead with a stitch bond.
THE REJECTIONS
Claim 7 stands rejected under 35 U.S.C. § 112, second
paragraph, as failing to particularly point out and distinctly
claim the subject matter the appellants regard as the invention.
2
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