Appeal No. 2004-2226
Application NO. 10/066,421
end of a second wire 24 as being attached to the interposer pad
with a ball bond 23 and a second end of the second wire as being
attached to the lead with a stitch bond 25. Although lacking an
express description of the bond by which the second end of the
first wire 20 is attached to the interposer pad, the original
disclosure as a whole, and particularly the descriptions of wire
13 in Figure 1 and wire 20 in Figure 2 as having one end attached
with a ball bond and the other end attached with a stitch bond,
would reasonably convey to the artisan that the second end of the
first wire 20 is attached to the interposer pad with a stitch
bond. Thus, the disclosure of the application as originally
filed would reasonably convey to the artisan that the appellants
had possession at that time of subject matter meeting the various
limitations in the claims relating to the attachment of the ends
of the first and second bonding wires by either a stitch bond or
a ball bond.
The examiner also voices concern about the limitations in
the claims pertaining to the interposer electro-less substrate,
the ball grid array, and the electrically floating nature of the
interposer pad(s) (see page 4 in the answer). The first two
features find express support in the original disclosure (see
pages 2 and 5 in the specification) and the third finds implicit
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