Ex Parte Chopra - Page 1



          The opinion in support of the decision being entered today was not written for
          publication and is not binding precedent of the Board.                      


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    ____________                                      
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    ____________                                      
                               Ex parte DINESH CHOPRA                                 
                                    ____________                                      
                                Appeal No. 2005-0123                                  
                             Application No. 10/114,759                               
                                    ____________                                      
                                HEARD: April 6, 2005                                  
                                    ____________                                      
          Before HAIRSTON, GROSS, and BARRY, Administrative Patent Judges.            
          GROSS, Administrative Patent Judge.                                         


                                 DECISION ON APPEAL                                   
               This is a decision on appeal from the examiner's final                 
          rejection of claims 1 through 10, which are all of the claims               
          pending in this application.                                                
               Appellant's invention relates to forming contacts in an                
          integrated circuit.  The disclosed method includes forming on a             
          semiconductor layer a barrier layer having a sublayer of metal              
          nitride and a substantially pure metal layer and electroplating             
          on the pure metal layer a conductive layer.  Claim 1 is                     
          illustrative of the claimed invention, and it reads as follows:             





Page:  1  2  3  4  5  6  7  8  9  10  11  12  Next 

Last modified: November 3, 2007