The opinion in support of the decision being entered today was not written for publication and is not binding precedent of the Board. UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte DINESH CHOPRA ____________ Appeal No. 2005-0123 Application No. 10/114,759 ____________ HEARD: April 6, 2005 ____________ Before HAIRSTON, GROSS, and BARRY, Administrative Patent Judges. GROSS, Administrative Patent Judge. DECISION ON APPEAL This is a decision on appeal from the examiner's final rejection of claims 1 through 10, which are all of the claims pending in this application. Appellant's invention relates to forming contacts in an integrated circuit. The disclosed method includes forming on a semiconductor layer a barrier layer having a sublayer of metal nitride and a substantially pure metal layer and electroplating on the pure metal layer a conductive layer. Claim 1 is illustrative of the claimed invention, and it reads as follows:Page: 1 2 3 4 5 6 7 8 9 10 11 12 NextLast modified: November 3, 2007