Ex Parte ABDELGADIR et al - Page 1



               The opinion in support of the decision being entered                   
               today was not written for publication in a law journal                 
               and is not binding precedent of the Board.                             
                                                               Paper No. 29           
                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                  Ex parte MAHJOUB ALI ABDELGADIR and ALVARO MAURY                    
                                                                                     
                                Appeal No. 2005-0339                                  
                             Application No. 09/376,039                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     
          Before KIMLIN, PAK and TIMM, Administrative Patent Judges.                  
          KIMLIN, Administrative Patent Judge.                                        
                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 1, 2,             
          4-19 and 21-28, all the claims remaining in the present                     
          application.  Claim 1 is illustrative:                                      
               1.  A method of making an integrated circuit comprising:               
               forming a conductive layer, having conductive lines with               
          gaps therebetween, adjacent a semiconductor substrate, including            
          forming at least some of the conductive lines with different                
          widths;                                                                     
               depositing a fluoro-silicate glass (FSG) layer including               
          forming peaks having larger heights for larger widths of the                
          conductive lines, by high-density plasma chemical vapor                     

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