Appeal No. 2005-0624
Application No. 09/853,506
1. A three-layered, laminated circuit structure,
comprising:
a first substrate having conductive via through
holes disposed therein;
a second substrate laminated to said first
substrate and having conductive, adhesive-filled
via through holes that align with, and make
electrical contact with, the conductive via
through holes of said first substrate; and
a third substrate laminated to said second
substrate having via through holes that align
with, and make electrical contact with, the
adhesive filled via through holes of said second
substrate, thus forming said three-layered,
laminated circuit structure.
THE REFERENCE
DiStefano et al. (DiStefano) 5,640,761 Jun. 24, 1997
THE REJECTION
Claims 1, 2, 4-7, 11, 12 and 14 stand rejected under
35 U.S.C. § 102(b) as being anticipated by DiStefano.
OPINION
We affirm the aforementioned rejection.
The appellants indicate that the claims stand or fall
together (brief, page 4).1 We therefore limit our discussion to
1 To the extent that the appellants’ argument that claim 5
requires slightly undercut conductive pads that are not disclosed by
DiStefano is a separate argument for patentability (brief, page 6),
this argument is not well taken because the appellants are arguing a
limitation that is not in claim 5. See In re Self, 671 F.2d 1344,
1348, 213 USPQ 1, 5 (CCPA 1982).
2
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