Appeal No. 2005-0624
Application No. 09/853,506
The appellants argue that DiStefano’s interposer layer 12a
does not have a distinct plated via through hole that aligns with
plated via through holes of circuit panels 10a and 10b (brief,
page 5). The appellants are incorrect. DiStefano’s interconnect
location 46a of via 48a in interposer layer 12a is aligned with
interconnect location 56a of via 26 in circuit panel 10a, and
interconnect location 47a opposite interconnect location 46a in
interposer layer 12a is aligned with interconnect location 58a of
via 26 in circuit panel 10b (col. 18, lines 40-47).
The appellants argue that “because [DiStefano’s] dielectric
elements 38 and 40 are flowable, it is not possible that the
interposer layer can properly be described as making the
alignment of the vias by way of lamination” (brief, page 6).
This argument is not well taken because DiStefano teaches that
“[t]he flowable dielectric material layers 38 and 40 are
interrupted by the holes and by elements 48 so that the flowable
conductive [sic, dielectric] material is not present at
interconnect locations 46 and 47 of the interposer” (col. 16,
lines 48-51). Although some dielectric material of layers 38
and 40 can bulge into space originally occupied by flowable
conductive material 48a in a via of the interposer layer
(col. 20, lines 55-58), the conductive material 48a still is
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