Appeal No. 2005-0624
Application No. 09/853,506
one claim, i.e., claim 1. See In re Ochiai, 71 F.3d 1565, 1566
n.2, 37 USPQ2d 1127, 1129 n.2 (Fed. Cir. 1995); 37 CFR
§ 1.192(c)(7)(1997).
DiStefano discloses a three-layered laminated circuit
structure comprising circuit panel 10a having conductive via
through holes 26 disposed therein, an interposer layer 12a
laminated to circuit panel 10a and having conductive,
adhesive-filled via through holes 48 that align with, and make
electrical contact with, the conductive via through holes of
circuit panel 10a (col. 4, lines 57-59; col. 16, line 52 -
col. 17, line 19; col. 18, lines 40-43; col. 19, lines 3-9, 17-
31, 38-47 and 63-66), and a circuit panel 10b which is laminated
to interposer layer 12a and has via through holes that align
with, and make electrical contact with, the adhesive filled via
through holes of interposer layer 12a (col. 18, lines 43-47;
figure 2).
The appellants argue that DiStefano’s interposer layer 12a
is not designed as a power core layer (brief, page 5). This
argument is not convincing because it is directed toward a
limitation which is not in claim 1. See In re Self, 671 F.2d
1344, 1348, 213 USPQ 1, 5 (CCPA 1982).
3
Page: Previous 1 2 3 4 5 6 7 Next
Last modified: November 3, 2007