Appeal No. 2005-0896
Application 09/947,125
protection pad positioned on a portion thereof to substantially
reduce stress concentration in an electrical connection between a
circuit pattern of the printed circuit board and a conductive
bump on a corner portion of the semiconductor chip. Claim 6 is
illustrative:
6. A printed circuit board adapted for having a
semiconductor chip directly mounted thereon, said semiconductor
chip including a conductive bump on a corner portion thereof,
said circuit board comprising:
an insulating layer including a first portion and a second
portion positioned under said first portion;
a circuit pattern positioned on said first portion of said
insulating layer and adapted for having an electrical connection
thereon, for being directly electrically connected to said
conductive bump on said corner portion of said semiconductor
chip; and
a protection pad positioned on said second portion of said
insulating layer so as to substantially reduce stress
concentration in said electrical connection between said circuit
pattern positioned on said first portion of said insulating layer
and said conductive bump of said semiconductor chip.
THE REFERENCES
Melton et al. (Melton) 5,233,504 Aug. 3, 1993
Angulas et al. (Angulas) 5,435,732 Jul. 25, 1995
THE REJECTION
Claims 6-14 stand rejected under 35 U.S.C. § 103 as being
unpatentable over Angulas in view of Melton.
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