Appeal No. 2005-0896
Application 09/947,125
col. 4, lines 27-28 and 47-63; col. 5, lines 27-34 and 59-62;
col. 6, lines 48-51). Within dielectric layer 15 are
electrically conducting layers (17 and 19; figure 6) that may
function as signal, power and/or ground layers (col. 4, lines 32-
44). A semiconductor chip (43) is mounted on the thin flexible
circuitized substrate using solder joints (45) (col. 8, lines 27-
33; figure 10).
Angulas does not disclose mounting the semiconductor chip
directly on circuitized substrate 13. However, Melton teaches
that in a flip-chip process, such direct mounting is an
alternative to mounting using a carrier (col. 6, lines 14-17).
Consequently, the combined teachings of the references would have
fairly suggested, to one of ordinary skill in the art, mounting
Angulas’ semiconductor chip either by use of a carrier or by
direct mounting on circuitized substrate 13.
The appellants argue that Angulas is silent with respect to
protection pads and that because Angulas’s chip is on a carrier,
Angulas does not have the problem addressed by the appellants of
coefficient of thermal expansion mismatch between a semiconductor
chip and a substrate on which the semiconductor chip is directly
mounted (brief, page 5). The appellants’ protection pads (9) are
copper layers formed either by electroless plating or by adhering
4
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007