UNITED STATES PATENT AND TRADEMARK OFFICE
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BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
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Ex parte JOHN LIEBESKIND, JAMES C. MCKINNELL,
PAUL J. BENNING and CHIEN-HUA CHEN
Appeal No. 2005-0971
Application No. 10/114,392
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ON BRIEF
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Before THOMAS, GROSS, and MACDONALD, Administrative Patent Judges.
MACDONALD, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the final rejection of claims 29-30, 33-38,
40-41, 46-47, 49-50, 52-57, and 60-68. Claims 31-32, 39, 42-45, 48, 51, and 58-
59 have been indicated to be allowable if rewritten. Claims 1-28 have been
cancelled.
Invention
Appellants’ invention relates to a method for forming an electrical device
where a plurality of integrated circuits on a first substrate are bonded to a second
substrate by a bond that deforms above, but not below, a deformation condition
of pressure from opposing surfaces on the first and second substrates with or
without temperature variations. Appellants’ specification at page 3, paragraph
0005.
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