Appeal No. 2005-0971 Page 2
Application No. 10/114,392
Claim 66 is representative of the claimed invention and is reproduced as
follows:
66. A method comprising bonding opposing surfaces on a plurality of wafers
using a bonding structure, wherein:
one or more of the wafers has a plurality of integrated circuits fabricated
therein;
the bonding includes deforming the bonding structure until a
predetermined gap exists between the opposing surfaces and a deformation
condition is applied t the bonding structure at which the bonding structure
deforms above the deformation condition, but not below the deformation
condition; and
the deformation condition is selected from the group consisting of:
a predetermined pressure on the bonding structure; and
a predetermined combination of temperature and pressure on the bonding
structure.
Reference
The reference relied on by the Examiner is as follows:
Hays et al. (Hays) 6,252,229 Jun. 26, 2001
Rejections At Issue
Claim 66 stands rejected under 35 U.S.C. § 102 as being anticipated by
Hays.
Claims 29-30, 33-38, 40-41, 46-47, 49-50, 52-57, 60-65, and 67-68 stand
rejected under 35 U.S.C. § 103 as being obvious over Hays.
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